Econodual
Product Description
Category SiC 模块
Characteristics
- Uses vacuum reflow soldering technology, Cu base plate + low thermal conductivity AlN insulation ceramic, maximum operating junction temperature of 175°C;
- High power density, suitable for high-temperature, high-frequency applications, ultra-low loss;
- Integrated NTC temperature sensor, easy system integration;
- Normally-off power module, zero tail current, parasitic inductance less than 15nH, low switching loss.